Affiliation: | 1. Department of Medical and Clinical Psychology, Tilburg University, Tilburg, The Netherlands Department of Obstetrics and Gynaecology, Máxima Medical Centre, Veldhoven, The Netherlands;2. Department of Obstetrics and Gynaecology, Máxima Medical Centre, Veldhoven, The Netherlands;3. Department of Child and Adolescent studies, Utrecht University, Utrecht, The Netherlands;4. UvA minds–Academic Treatment Centre for Parent and Child, University of Amsterdam, Amsterdam, The Netherlands;5. Department of Medical and Clinical Psychology, Tilburg University, Tilburg, The Netherlands |
Abstract: | Since disturbances in the mother–child bond increase the risk of negative consequences for child development, it is important to identify risk and protective factors for bonding as well as longitudinal associations. Previous research has used different bonding instruments during pregnancy and the postnatal phase, leading to inconsistent results. In the current study, the same instrument was used during the various phases. In a large, community-based sample (N = 793), general information, feelings of pre- and postnatal bonding (Pre- and Postnatal Bonding Scale), depressive symptoms (Edinburgh Postnatal Depression Scale), and partner support (subscale Tilburg Pregnancy/Postnatal Distress Scale) were measured at both 32 weeks of pregnancy and 8 months postnatally. Partner support was found to be a protective factor for suboptimal pre- and postnatal bonding, as was the engagement with fetal movements for prenatal bonding. High maternal educational level was a risk factor for suboptimal prenatal bonding, as were depressive symptoms for suboptimal postnatal bonding. The associations between most prenatal determinants and postnatal bonding were mediated by prenatal bonding, which underlines the importance of promoting prenatal bonding. Professionals in clinical practice should be aware of partner support, engagement with fetal movements, and postnatal depressive symptoms: All these factors offer opportunities for improving the bonding processes. |