Discontinuous growth of tin whiskers |
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Authors: | B. Jiang |
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Affiliation: | Shenyang National Laboratory for Materials Science , Institute of Metal Research , Chinese Academy of Science, 72 Wenhua Road, Shenyang 110016, China |
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Abstract: | Three types of discontinuous growth behaviour of tin whiskers are described. First, growth bands were observed in whiskers on a tin finish held in an ambient environment for 30 days after plating; the spacing between the growth bands was 0.2–0.4?µm. Second, growth of a whisker was discontinuous with time, in which there was about 30 days of stagnation, after which whisker growth reoccurred. Third, an irregular whisker with a triangular morphology and abruptly changing cross-section was observed by SEM. Discontinuous whisker growth behaviour challenges the previously proposed mechanism of tin whisker growth. It is postulated that alternating breakdown and self-curing in air of an oxide film at point defects could be a reason for discontinuous growth of whiskers. |
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