In-situ X-ray diffraction during tensile deformation of ultrafine-grained copper using synchrotron radiation

At the synchrotron facility, Super Photon Ring – 8 GeV, in-situ X-ray diffraction during tensile deformation was conducted on ultrafine-grained Cu with a grain size of about 300 nm fabricated by equal-channel angular pressing. The diffraction profile was observed with the time resolution of about 1 s using multiple MYTHEN detectors, and the diffraction angle and the full-width at half-maximum of some Bragg peaks were determined using the pseudo-Voigt function. From the analysis of Bragg peaks, it was found out that there are microscopically three regions; elastic, plastic and transition regions. The 0.2% proof stress obtained from the stress–strain curve locates within the microscopic transition region. Microstrain was evaluated using the Williamson–Hall method and the dislocation density was also obtained from the microstrain. The dislocation density starts increasing before 0.2% proof stress, which is associated with dislocation bow-out and emission from grain boundaries. The Taylor relationship seems to be still satisfied after 0.2% proof stress.