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Computer-aided analysis of grain-boundary connectivity of B10 copper-nickel alloys |
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| Authors: | Yuehua Dong Yongxin Zhou Xingyu Feng Hang Wang |
| Affiliation: | 1. School of Information Engineering, Jiangxi University of Science and Technology, GanZhou, People’s Republic of China;2. School of Material Science and Engineering, Jiangxi University of Science and Technology, Ganzhou, People’s Republic of China;3. Institute of Engineering and Research, Jiangxi University of Science and Technology, Ganzhou, People’s Republic of China |
| Abstract: | A numerical calculation method based on the angle in a triple junction composed of a random grain boundary is proposed to predict the connectivity and stability of a grain boundary in a B10 copper-nickel alloy. The grain-boundary connectivity and its effect on corrosion resistance are studied combining computer-aided analysis with electrochemical impedance testing. The results show that the prediction of corrosion resistance using a grain-boundary connectivity numerical method is consistent with immersion experimental results. The B10 alloy exhibited the best corrosion resistance after cold rolling with a 9% reduction rate. The relationship between the grain-boundary characteristics and corrosion resistance is well established using the numerical method to quantify the grain-boundary connectivity. A higher connective frequency and a low proportion of grain-boundary angles between 60° and 180° in the triple junction is detrimental to corrosion resistance of the B10 alloy. |
| Keywords: | B10 copper-nickel alloy grain-boundary triple junction grain boundary connectivity numerical method corrosion resistance |