Discontinuous cracking of TiN films on a steel substrate induced by an adhesive interlayer |
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| Authors: | Tao Guo Jianying He |
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| Institution: | 1. Beijing Advanced Innovation Center for Materials Genome Engineering, Beijing, People’s Republic of China;2. Department of Materials Physics and Chemistry, University of Science and Technology Beijing, Beijing, People’s Republic of China;3. Corrosion and Protection Center, University of Science and Technology Beijing, Beijing, People’s Republic of China;4. Department of Structural Engineering, Norwegian University of Science and Technology (NTNU), Trondheim, Norway |
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| Abstract: | ABSTRACTThe basic mechanisms governing the process of cracking of single-layer brittle films have been extensively explored through both simulations and experiments. However, the role that an adhesive interlayer plays in the cracking of the overlying brittle film remains unclear. By performing three-point bending experiments, we observed that the insertion of a 100?nm thick Ti interlayer changed the cracking behaviour of TiN films from a continuous pattern to a discontinuous pattern. The slight change in the microstructure of the film and the increase in film thickness arising from the addition of the Ti interlayer are unlikely to cause the observed cracking morphology. The combination of the different interface between the Ti and the steel substrate and the fracture of the Ti interlayer are responsible for the transition in the TiN film cracking morphologies. |
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| Keywords: | TiN film Ti interlayer cracking morphology transition interfaces interlayer fracture |
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