Influence of crystallographic orientation on cyclic strain-hardening behaviour of copper single crystals

The cyclic strain-hardening behaviour of copper single crystals with various slip orientations is considered systematically. It is shown that the crystallographic orientation has a strong effect on the cyclic hardening behaviours of double- and multiple-slip-oriented copper single crystals. The initial cyclic hardening of differently oriented copper single crystals is mainly dependent on the modes and intensities of dislocation interactions between slip systems operating in the crystal, as well as on the possibility of cross-slip. A distinctive strain burst phenomenon has been frequently observed in the very early stage of cyclic hardening for critical double-slip-oriented crystals. A secondary cyclic hardening stage occurs readily late in cyclic deformation of coplanar doubleslip-oriented crystals.     

Efficient atomic packing clusters and glass formation in ternary Al-based metallic glasses

In this article, we propose an efficient atomic packing cluster-based composition protocol to help design Al-based metallic glasses. Its validity is verified by some typical experimental data from the literatures. Furthermore, with this understanding, the Al–Ni–Y alloy system is re-evaluated. As a result, the best glass former Al₈₆Ni₉Y₅ in this system, with the critical thickness of about 500 µm, is successfully fabricated by wedge casting.     

Nucleation of the C40-to-C11 b transformation in magnetron-sputtered MoSi 2 thin films

Transmission electron microscopy has been used to reveal the microstructure of metastable C40 MoSi 2 thin films produced by annealing amorphous magnetron-sputtered deposits at 700°C. The films contain nanoscale acicular grains elongated parallel to (0001), with extensive basal faulting. The faults are intrinsic with R ´ 1/3[0001] and correspond to thin slabs of the equilibrium C11 b phase. It is proposed that these faults may act as nuclei for the subsequent transformation from C40 to C11 b by a process akin to discontinuous coarsening.     

TEM observation of the restrained Goss–Brass orientation transformation in a warm-rolled Fe–28Mn–6Si–5Cr shape memory alloy

A dominant Goss texture component instead of a Brass texture component has been observed in a warm-rolled Fe–28Mn–6Si–5Cr shape memory alloy [H. Li, F. Yin, T. Sawaguchi K. Ogawa, X. Zhao and K. Tsuzaki, Mater. Sci. Eng. A 494 (2008) p.217]. In order to clarify the orientation flow mechanism in these grains of Goss orientation, investigations on microtexture and microstructure were carried out by electron backscattering diffraction (EBSD) and transmission electron microscopy (TEM). It is concluded that the Goss–Brass orientation transformation is restrained in the Goss-orientated grains, which were widely observed in both the deformed matrix and shear bands.     

Solubility criterion for sequential disordering in metal-metal multilayers upon solid-state reaction

An n-body Ni-Ti potential is derived and applied in a molecular dynamics simulation to study the maximum supersaturated solubility of the terminal solid solutions and solid-state reaction in a Ni/Ti bilayer. It reveals that during interfacial reaction of the Ni/Ti bilayer the Ti lattice reaches its maximum solubility by dissolving Ni earlier than Ni does through dissolution of Ti, which results in a sequential disordering of first Ti and then Ni, although Ti has a higher melting point than Ni. In the Ni-Zr, Ni-Mo and Ni-Ta systems, however, the Ni lattice collapses more rapidly because it reaches a maximum solubility earlier than its partners, which have higher melting points than Ni. A solubility criterion is thus relevant for all the above cases; the lower the maximum solid solubility the less stable is the lattice of the metal upon solid-state reaction.     

Elastic solutions with arbitrary elastic inhomogeneity and anisotropy

An efficient numerical algorithm is proposed to accurately compute the elastic fields in two-dimensional (2D) or three-dimensional (3D) microstructures with arbitrary elastic inhomogeneity and anisotropy. It combines the equivalent inclusion method of Eshelby, the microelasticity theory of Khachaturyan, and the spectral iterative perturbation method of Hu and Chen. Its efficiency is compared with those of existing approaches in the literature. The method can be conveniently implemented in phase-field modeling of stress-dependent microstructure evolution and/or of mass/electrical transport.     

Identification of crystal nucleation and growth in an amorphous FeZr2 alloy by means of electrical resistance measurements

A polymorphous crystallization process in an amorphous FeZr₂ alloy has been investigated by means of accurate electrical resistance measurements (ERMs) at elevated temperatures. It was found that, upon crystallization of the amorphous alloy, the electrical resistance increased with increasing temperature, exhibiting three distinct stages. Quantitative microscopy observations revealed that the three stages originated from crystal nucleation, from subsequent growth of crystal nuclei and from coarsening of the crystallites respectively. The activation energies for the crystal nucleation and growth determined from the ERM data agree satisfactorily with the data in the literature. The success in identification of the crystal nucleation and growth processes by means of ERMs may originate from differences in electrical resistance changes due to the crystal formation and the crystalline-amorphous interface formation processes from the amorphous phase.     

Intermetallic compound identification and Kirkendall void formation in eutectic SnIn/Cu solder joint during solid-state aging

Microstructural investigations were performed on the interfacial reactions between eutectic SnIn solder and Cu substrate during reflowing at 433?K and solid-state aging at 373?K. Cu₂(In,Sn) was identified as the only intermetallic compound (IMC) at the interface, which consists of two sublayers with different morphology, a fine-grained sublayer at the Cu side and a coarse-grained sublayer at the solder side. During solid-state aging, voids were found between these two Cu₂(In,Sn) sublayers but not at the substrate interface, which is also attributed to the Kirkendall effect considering the different diffusion fluxes of Sn or In and Cu atoms in different sublayers.     

Scale-dependent fracture mode in Cu–Ni laminate composites

Fracture behavior of Cu–Ni laminate composites has been investigated by tensile testing. It was found that as the individual layer thickness decreases from 100 to 20 nm, the resultant fracture angle of the Cu–Ni laminate changes from 72° to 50°. Cross-sectional observations reveal that the fracture of the Ni layers transforms from opening to shear mode as the layer thickness decreases while that of the Cu layers keeps shear mode. Competition mechanisms were proposed to understand the variation in fracture mode of the metallic laminate composites associated with length scale.